What is Cu clip package? copper alloys

Power chips are connected to external circuits through packaging, and their efficiency relies on the support of the packaging. In high-power scenarios, power chips are usually packaged as power modules. Chip interconnection refers to the electric link on the top surface area of the chip, which is usually aluminum bonding wire in standard modules. ^
Conventional power module package cross-section

Presently, industrial silicon carbide power components still primarily make use of the packaging innovation of this wire-bonded typical silicon IGBT component. They face problems such as big high-frequency parasitic criteria, inadequate warmth dissipation capacity, low-temperature resistance, and not enough insulation stamina, which limit using silicon carbide semiconductors. The screen of exceptional performance. In order to fix these troubles and totally manipulate the significant prospective benefits of silicon carbide chips, several brand-new product packaging modern technologies and services for silicon carbide power modules have arised over the last few years.

Silicon carbide power component bonding technique

(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)

Bonding materials have actually established from gold cord bonding in 2001 to aluminum cord (tape) bonding in 2006, copper cable bonding in 2011, and Cu Clip bonding in 2016. Low-power devices have actually established from gold cords to copper wires, and the driving force is price reduction; high-power devices have actually developed from aluminum cables (strips) to Cu Clips, and the driving pressure is to boost item efficiency. The higher the power, the greater the needs.

Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging procedure that makes use of a solid copper bridge soldered to solder to attach chips and pins. Compared with typical bonding packaging methods, Cu Clip technology has the following advantages:

1. The link between the chip and the pins is made from copper sheets, which, to a specific level, replaces the basic wire bonding method in between the chip and the pins. Consequently, an unique package resistance value, higher present circulation, and far better thermal conductivity can be obtained.

2. The lead pin welding area does not require to be silver-plated, which can completely conserve the price of silver plating and inadequate silver plating.

3. The product look is completely regular with normal products and is mostly used in servers, portable computers, batteries/drives, graphics cards, motors, power materials, and various other areas.

Cu Clip has two bonding techniques.

All copper sheet bonding approach

Both eviction pad and the Resource pad are clip-based. This bonding approach is extra costly and complicated, but it can achieve far better Rdson and far better thermal results.

( copper strip)

Copper sheet plus cable bonding technique

The source pad makes use of a Clip method, and the Gate uses a Cable method. This bonding technique is somewhat less costly than the all-copper bonding approach, conserving wafer location (applicable to very small gateway areas). The procedure is easier than the all-copper bonding approach and can obtain much better Rdson and much better thermal impact.

Provider of Copper Strip

TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding copper alloys, please feel free to contact us and send an inquiry.

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